LIGHT BORN FROM THE CORE OF QUALITY

SMD LEDs, DIP Through-Hole LEDs & Mid-to-High-End Custom Optoelectronic Components

Mid-to-High-End Industrial Quality  |  Grade-A Chips / 99.99% Gold Wire / Imported Encapsulant  |  Monthly Capacity 200KK

HC-LED (Hongcheng Optoelectronics), a GTY Group member, delivers LED light sources and precision optoelectronic component processing solutions for B2B customers worldwide

Browse Products → Download Datasheets Request Technical Support ▶ VR Factory Tour

Take a 360° virtual tour of the group member factory — LED packaging lines, die & wire bonding stations, and QC labs, all without leaving your desk.

GTY GROUP

Front-End Manufacturing — Back-End Precision Processing — Global Trade

GTY Group coordinates its worldwide business through GTY Group International (HK) Co., Limited, with front-end LED chip packaging by Guangdong Guangyu Semiconductor Technology Co., Ltd. and Dongguan Hongcheng Optoelectronics Co., Ltd. as the group's core domestic operator — 20+ years in optoelectronics with over RMB 100 million invested, delivering LED light sources and precision optoelectronic processing solutions for B2B customers worldwide.

Explore GTY Group History →

40 LinesFully Automated Precision Packaging
200KKMonthly Capacity
50%+Premium Overseas Materials
20+ YrsIn Optoelectronics

VR FACTORY TOUR

40 Automated Lines · Full-Process Live View · Remote Factory Audit

Take a virtual walk through our production floor — ASM fully automated lines covering all five core processes: Die Bonding: grade-A chips placed with micron-level precision; Wire Bonding: 99.99% pure gold wire ball bonding with 100% pull testing; Encapsulation: Japanese epoxy vacuum dispensing, heat-resistant and anti-sulfuration, survives dual reflow soldering; Binning: automatic sorting by brightness, wavelength and voltage for industry-leading BIN consistency; Aging: high-temperature aging and reliability sampling keep failure rates at PPM level. A Guangyu Group member with 20+ years in LED packaging, supporting custom DIP, SMD and addressable RGB LED series.

PRODUCT ANATOMY

Grade-A Chips · Gold Wire · Imported Encapsulant

SMD LED Anatomy

SMD LED Anatomy
Bonding Wire99.99% pure gold wire, stable quality
EncapsulantImported epoxy, reflow-capable, high-temp resistant
ChipGrade-A die, high ESD resistance
PlatingAu/Ag plated PCB, anti-oxidation, easy soldering
BaseHigh-temp resistant, warp-free

Through-Hole LED Anatomy

Through-Hole LED Anatomy
Bonding Wire99.99% gold wire, stable quality
Epoxy ResinHigh-temp potting, strong adhesion
ChipSelected Grade-A, high ESD resistance
Lead Frame15-20μm silver plating, anti-oxidation, fast heat dissipation
enlarged view

CHIP GRADE COMPARISON

We Use Grade-A Chips Only

A
Grade-A chips ("square dies") — strictly inspected and binned by the chip maker with reverse leakage fully controlled
High-End
B
Grade-B chips ("pseudo-square") — shipped without strict inspection, higher leakage current
Mid-Range
C
Grade-C chips ("round wafers") — diced and shipped directly without any inspection
Entry-Level

PRODUCTS & CUSTOM SERVICES

0201-5730 SMD · RGB/RGBW · 2-10mm DIP · Custom Lamps

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