LIGHT BORN FROM THE CORE OF QUALITY

SMD LEDs, DIP Through-Hole LEDs & Mid-to-High-End Custom Optoelectronic Components

Mid-to-High-End Industrial Quality | Grade-A Chips / 99.99% Gold Wire / Imported Encapsulant | Monthly Capacity 200KK

HC-LED (Hongcheng Optoelectronics), a GTY Group member, delivers LED light sources and precision optoelectronic component processing solutions for B2B customers worldwide

Browse Products → Download Datasheets Request Technical Support ▶ VR Factory Tour

Take a 360° virtual tour of the group member factory — LED packaging lines, die & wire bonding stations, and QC labs, all without leaving your desk.

GTY GROUP

Front-End Manufacturing — Back-End Precision Processing — Global Trade

GTY Group coordinates its worldwide business through GTY Group International (HK) Co., Limited, with front-end LED chip packaging by Guangdong Guangyu Semiconductor Technology Co., Ltd. and Dongguan Hongcheng Optoelectronics Co., Ltd. as the group's core domestic operator — 20+ years in optoelectronics with over RMB 100 million invested, delivering LED light sources and precision optoelectronic processing solutions for B2B customers worldwide.

Explore GTY Group History →

40 LinesFully Automated Precision Packaging

200KKMonthly Capacity

50%+Premium Overseas Materials

20+ YrsIn Optoelectronics

VR FACTORY TOUR

40 Automated Lines · Full-Process Live View · Remote Factory Audit

Take a virtual walk through our production floor — ASM fully automated lines covering all five core processes: Die Bonding: grade-A chips placed with micron-level precision; Wire Bonding: 99.99% pure gold wire ball bonding with 100% AOI inspection; Encapsulation: Japanese epoxy vacuum dispensing, heat-resistant and anti-sulfuration, survives dual reflow soldering; Binning: automatic sorting by brightness, wavelength and voltage for same-BIN shipment per batch with project-level BIN locking; Aging: high-temperature aging and reliability sampling keep failure rates at PPM level. A Guangyu Group member with 20+ years in LED packaging, supporting custom DIP, SMD and addressable RGB LED series.

PRODUCT ANATOMY

Grade-A Chips · Pure Gold Wire · Imported Encapsulant

SMD LED Anatomy

Bonding Wire99.99% pure gold wire, stable quality
EncapsulantImported epoxy, high-temp resistant, survives two reflow cycles
ChipGrade-A die, high ESD resistance
PlatingAu/Ag plated PCB, anti-oxidation, easy soldering
BaseHigh-temp resistant, warp-free

Through-Hole LED Anatomy

Through-Hole LED structure anatomy diagram

Bonding Wire99.99% pure gold wire, stable quality
Epoxy ResinHigh-temp potting, strong adhesion, no detachment
ChipGrade-A die, high ESD resistance
Lead Frame10-20μm silver plating, anti-oxidation, easy tinning, fast heat dissipation