VR Factory Tour ｜ Hongcheng LED Packaging Plant in 720°
Take a virtual walk through the production floor of Hongcheng Optoelectronics (Dongguan Hongcheng Optoelectronics Co., Ltd.), a Guangyu Group member with 20+ years in LED packaging. ASM fully automated lines cover all five core processes. The group operates 40 fully automatic high-precision packaging lines with a combined monthly capacity of 200KK units, supporting custom DIP, SMD and addressable RGB LED series.
Five Core Processes
1. Die Bonding
Grade-A chips placed on lead frames by fully automatic die bonders with micron-level placement accuracy.
2. Wire Bonding
99.99% pure gold wire ball bonding with 100% AOI inspection for reliable conductivity.
3. Encapsulation
Japanese epoxy vacuum dispensing, heat-resistant and anti-sulfuration, survives dual reflow soldering.
4. Binning
Automatic sorting by brightness, wavelength and voltage for industry-leading BIN consistency; BIN locking supported.
5. Aging
High-temperature aging and reliability sampling before shipment keep failure rates at PPM level.
Book an On-site Audit
On-site and video factory audits are welcome. Phone/WeChat: +86-139 2571 4318; Email: sales@led-hc.com. For product parameters see the Datasheet Download Center (375 official PDF datasheets, free download).
